• Bonding Service

    You need your parts now and have no machine ready?
    We offer bonding service for electronic components.

    Details
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  • A strong Partner

    You have ideas and want to bring your products to market quickly?

    Who we areWhat we do
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  • Your Product. Our Mission.

    We support you from your first idea to high volume production

    Discuss your dream
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  • You dream it, we build it!

    You know what you want, but not how to make it?
    You need your parts now, but are not ready to build it?

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Your reliable partner for wire bonding electronic components, process support and training.

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Proof of Concept, Pre-Production Prototype, Sample Bonding, Small Series Production, Standard Production

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Online Support – Direct & Safe  – On your Wire Bonder

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Process Support in Paderborn or at your facility, Support Hotline

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We offer specially tailored training courses for programmer / operator / admin / service as well as application training

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Design Validation Builds, Module Development and Production, Tool and Process Optimzation

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This form of cost consideration provides important assistance in answering business questions

Your Benefit

OVER 100 YEARS OF BONDING EXPERIENCE

Benefit from decades of bonding experience

PROFIT FROM EXPERTS IN BONDING

Specialists in fields of microtechnology, process & application engineering, mechanics, electronics, software and service

Flexibilty

Small sized as well as larges sizes substrates can be handled with bonding areas from 100 x 115 mm up to 700 x 1132 mm

INDIVIDUAL TRAININGS

We offer specially tailored training courses

PROCESS SUPPORT

We support you in developing and implementing your individual process requirements

Applications and Markets

What our customers say

Hesse provided the technical and equipment support to upgrade our BJ820 aluminum wedge bonder to meet our customers Chip on Board gold and ribbon wire high frequency applications. We now support both a 45 and 90 degree bond head options for speed critical and deep access bonding applications.

Richard MooreGeneral Manager, FAST Semiconductor Packaging (www.fastsemi.com)

Hesse helps us meet our power module fabrication needs. Their professional wire bonding services are fast and reliable.

Wenli ZhangResearch Assistant Professor / Packaging Lab Manager at Virginia Tech Center for Power Electronics Systems

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