Let your products be bonded by fine and heavy wire bonders equipped with the latest technology
Applications and Markets
What our customers say
Hesse provided the technical and equipment support to upgrade our BJ820 aluminum wedge bonder to meet our customers Chip on Board gold and ribbon wire high frequency applications. We now support both a 45 and 90 degree bond head options for speed critical and deep access bonding applications.
Hesse helps us meet our power module fabrication needs. Their professional wire bonding services are fast and reliable.