HCS – Hesse Customer Solutions

Bonding Service
You need your parts now and have no machine ready?
We offer bonding service for electronic components.

Details
A strong Partner
You have ideas and want to bring your products to market quickly?

Who we are What we do
Your Product. Our Mission.
We support you from your first idea to high volume production

Discuss your dream
You dream it, we build it!
You know what you want, but not how to make it?
You need your parts now, but are not ready to build it?

Your reliable partner for wire bonding electronic components, process support and training.

Our Services

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Production Service

Proof of Concept, Pre-Production Prototype, Sample Bonding, Small Series Production, Standard Production

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Online Support

Online Support – Direct & Safe – On your Wire Bonder

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Process Support

Process Support in Paderborn or at your facility, Support Hotline

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Training

We offer specially tailored training courses for programmer / operator / admin / service as well as application training

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Consulting

Design Validation Builds, Module Development and Production, Tool and Process Optimzation

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Cost of Ownership

This form of cost consideration provides important assistance in answering business questions

Your Benefit

WHOLE RANGE OF WIRE BONDERS

Let your products be bonded by fine and heavy wire bonders equipped with the latest technology

OVER 100 YEARS OF BONDING EXPERIENCE

Benefit from decades of bonding experience

PROFIT FROM EXPERTS IN BONDING

Specialists in fields of microtechnology, process & application engineering, mechanics, electronics, software and service

Flexibilty

Small sized as well as larges sizes substrates can be handled with bonding areas from 100 x 115 mm up to 700 x 1132 mm

INDIVIDUAL TRAININGS

We offer specially tailored training courses

PROCESS SUPPORT

We support you in developing and implementing your individual process requirements

Applications and Markets

E-Mobility – Battery Packs
• Contacting BMS/BMB
• Cell Interconnection
• Voltage Sensing

Automotive
• Electric Steering
• Gear Box Control
• Adaptive cruise control (long
range radar)
• LED Head Lights

Semiconductor Equipment
• Communication devices
• Aerospace
• Electronics industry

Application-Power-Semiconductor — Power Semiconductor
• Traction (Railways)
• Wind Mills
• Solar
• Inductive Heating
• Motor Control

What our customers say

Hesse provided the technical and equipment support to upgrade our BJ820 aluminum wedge bonder to meet our customers Chip on Board gold and ribbon wire high frequency applications. We now support both a 45 and 90 degree bond head options for speed critical and deep access bonding applications.

Richard MooreGeneral Manager, FAST Semiconductor Packaging (www.fastsemi.com)

Hesse helps us meet our power module fabrication needs. Their professional wire bonding services are fast and reliable.

Wenli ZhangResearch Assistant Professor / Packaging Lab Manager at Virginia Tech Center for Power Electronics Systems

Hesse Mechatronics