WHOLE RANGE OF WIRE BONDERS
Let your products be bonded by fine and heavy wire bonders equipped with the latest technology
Proof of Concept, Pre-Production Prototype, Sample Bonding, Small Series Production, Standard Production
We offer specially tailored training courses for programmer / operator / admin / service as well as application training
Design Validation Builds, Module Development and Production, Tool and Process Optimzation
This form of cost consideration provides important assistance in answering business questions
Let your products be bonded by fine and heavy wire bonders equipped with the latest technology
Benefit from decades of bonding experience
Specialists in fields of microtechnology, process & application engineering, mechanics, electronics, software and service
Small sized as well as larges sizes substrates can be handled with bonding areas from 100 x 115 mm up to 700 x 1132 mm
We offer specially tailored training courses
We support you in developing and implementing your individual process requirements