Hesse Customer Solutions – Das Unternehmen.
Whole range of wire bonders
Let your products be bonded by fine and heavy wire bonders equipped with the latest technology
30 Years of Bonding Experience
Benefit from decades of bonding experience
Profit from Experts in Bonding
Specialists in fields of microtechnology, process & application engineering, mechanics, electronics, software and service
Flexibility
Small sized as well as larges sizes substrates can be handled with bonding areas from 100 x 115 mm up to 700 x 1132 mm
Individual Trainings
We offer specially tailored training courses
Process Support
We support you in developing and implementing your individual process requirements.